The evolution of interface structure in TLP bonded joints of Al₂O_3p/6061Al composites with Cu/Ni/Cu interlayers

By Jiuchun Yan   Zhiwu Xu   Gaohui Wu   Shiqin Yang  

Journal of Materials Science, Vol. 40, Iss. 19, 2005-10 ,pp. : 5307-5309

Springer Publishing Company

Access to resources Recommend Favorite

Interface interaction in the (B₄C + TiB₂)/Cu system

By Aizenshtein M.   Frage N.   Froumin N.   Shapiro-Tsoref E.   Dariel M.  

Journal of Materials Science, Vol. 41, Iss. 16, 2006-08 ,pp. : 5185-5189

Springer Publishing Company

Access to resources Recommend Favorite

Hardness measurements of accumulative roll-bonded Mo foils

By Marathe G.   Hebert R.  

Journal of Materials Science, Vol. 45, Iss. 17, 2010-09 ,pp. : 4770-4777

Springer Publishing Company

Access to resources Recommend Favorite

Effect of thin Mo 2 C layer on thermal stability of Si/SiO 2 /Ti/Cu system

By Tripathi C.  

Bulletin of Materials Science, Vol. 34, Iss. 7, 2011-12 ,pp. : 1611-1615

Springer Publishing Company

Access to resources Recommend Favorite

Kinetics of interface reaction and intermetallics growth of Sn-3.5Ag-0.7Cu/Au/Ni/Cu system under isothermal aging

By Shi X. Q.   Kwan H. F.   Nai S. M. L.   Lim G. H.  

Journal of Materials Science, Vol. 39, Iss. 3, 2004-02 ,pp. : 1095-1099

Springer Publishing Company

Access to resources Recommend Favorite