Solid state intermetallic compound layer growth between Sn-8Zn-3Bi solder and bare copper substrate

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Journal of Materials Science: Materials in Electronics, Vol. 16, Iss. 8, 2005-08 ,pp. : 523-528

Springer Publishing Company

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Intermetallic growth study on SnAgCu/Cu solder joint interface during thermal aging

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Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate

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Journal of Materials Science, Vol. 39, Iss. 13, 2004-07 ,pp. : 4211-4217

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Correlation of intermetallic compound growth behavior and melt state of Sn-3.5Ag-3.5Bi/Cu joint during soldering and isothermal aging

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Journal of Materials Science: Materials in Electronics, Vol. 24, Iss. 4, 2013-04 ,pp. : 1231-1237

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Formation and behavior of Kirkendall voids within intermetallic layers of solder joints

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Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 7, 2011-07 ,pp. : 703-716

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