Influence of temperature gradient and growth rate on the mechanical properties of directionally solidified Sn-3.5 wt% Ag eutectic solder

By Çadırlı E.  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 31-40

Springer Publishing Company

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Dependence of electrical and thermal conductivity on temperature in directionally solidified Sn-3.5 wt% Ag eutectic alloy

By Çadırlı E.  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 11, 2011-11 ,pp. : 1709-1714

Springer Publishing Company

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Predicting dendrite arm spacing and their effect on microporosity formation in directionally solidified Al-Cu alloy

By Melo M. L. N. M.   Rizzo E. M. S.   Santos R. G.  

Journal of Materials Science, Vol. 40, Iss. 7, 2005-04 ,pp. : 1599-1609

Springer Publishing Company

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The effect of composition on microhardness and determination of electrical and thermal properties in the Sn-Cu alloys

By Çadırlı E.   Kaya H.  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 9, 2011-09 ,pp. : 1378-1386

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Effect of peritectic reaction on dendrite coarsening in directionally solidified Sn–36 at.%Ni alloy

By Peng Peng   Li Xinzhong   Su Yanqing   Liu Dongmei   Guo Jingjie   Fu Hengzhi  

Journal of Materials Science, Vol. 47, Iss. 16, 2012-08 ,pp. : 6108-6117

Springer Publishing Company

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