Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate

By Yoon Jeong-Won   Jung Seung-Boo  

Journal of Materials Science, Vol. 39, Iss. 13, 2004-07 ,pp. : 4211-4217

Springer Publishing Company

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Correlation of intermetallic compound growth behavior and melt state of Sn-3.5Ag-3.5Bi/Cu joint during soldering and isothermal aging

By Li Xiaoyun  

Journal of Materials Science: Materials in Electronics, Vol. 24, Iss. 4, 2013-04 ,pp. : 1231-1237

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The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)₆Sn₅ compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction

By Tseng Chien-Fu   Duh Jenq-Gong  

Journal of Materials Science, Vol. 48, Iss. 2, 2013-01 ,pp. : 857-865

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Interfacial reactions of Sn-3.5% Ag and Sn-3.5% Ag-0.5% Cu solder with electroless Ni/Au metallization during multiple reflow cycles

By Sharif Ahmed   Chan Y.  

Journal of Materials Science: Materials in Electronics, Vol. 16, Iss. 3, 2005-03 ,pp. : 153-158

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Intermetallic growth study on SnAgCu/Cu solder joint interface during thermal aging

By Xiao H.  

Journal of Materials Science: Materials in Electronics, Vol. 24, Iss. 7, 2013-07 ,pp. : 2527-2536

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