Intermetallic reactions in a Sn-3.5Ag-1.5In solder ball-grid-array package with Au/Ni/Cu pads

By Chen Jie  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 11, 2011-11 ,pp. : 1703-1708

Springer Publishing Company

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Interfacial reactions between Sn-3.5 Ag solder and Ni–W alloy films

By Haseeb A.   Chew C.   Johan Mohd  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 9, 2011-09 ,pp. : 1372-1377

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Degradation of Sn37Pb and Sn3.5Ag0.5Cu solder joints between Au/Ni (P)/Cu pads stressed with moderate current density

By Wu B.   Zhong H.   Chan Y.   Alam M.  

Journal of Materials Science: Materials in Electronics, Vol. 17, Iss. 11, 2006-11 ,pp. : 943-950

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Microstructure of interfacial reaction layer in Sn–Ag–Cu/electroless Ni (P) solder joint

By Kang Han-Byul   Bae Jee-Hwan   Yoon Jeong-Won   Jung Seung-Boo   Park Jongwoo   Yang Cheol-Woong  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 9, 2011-09 ,pp. : 1308-1312

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Investigation of interfacial reaction and joint reliability between eutectic Sn–3.5Ag solder and ENIG-plated Cu substrate during high temperature storage test

By Yoon Jeong-Won   Chun Hyun-Suk   Jung Seung-Boo  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 5, 2007-05 ,pp. : 559-567

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