Superplastic power-law creep of Sn–40%Pb–2.5%Sb peritectic alloy

By Mahmudi R.   Rezaee-Bazzaz A.  

Journal of Materials Science, Vol. 42, Iss. 11, 2007-06 ,pp. : 4051-4059

Springer Publishing Company

Access to resources Recommend Favorite

Room-temperature indentation creep of lead-free Sn–Bi solder alloys

By Mahmudi R.   Geranmayeh A.   Mahmoodi S.   Khalatbari A.  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 10, 2007-10 ,pp. : 1071-1078

Springer Publishing Company

Access to resources Recommend Favorite

Structural, mechanical, hardness indentation measurements of Sn_65−x Ag₂₅Sb₁₀Cu_x solder alloys rapidly solidified from melt at cooling rate 1.1×10⁵ K s⁻¹

By Shalaby R. M.  

Journal of Materials Science: Materials in Electronics, Vol. 15, Iss. 4, 2004-04 ,pp. : 205-209

Springer Publishing Company

Access to resources Recommend Favorite

Effects of nano-structured particles on microstructure and microhardness of Sn–Ag solder alloy

By Tai F.   Guo F.   Xia Z.   Lei Y.   Shi Y.  

Journal of Materials Science: Materials in Electronics, Vol. 21, Iss. 7, 2010-07 ,pp. : 702-707

Springer Publishing Company

Access to resources Recommend Favorite

Investigation of microstructures and tensile properties of a Sn-Cu lead-free solder alloy

By Zhu Fulong   Zhang Honghai   Guan Rongfeng   Liu Sheng  

Journal of Materials Science: Materials in Electronics, Vol. 17, Iss. 5, 2006-05 ,pp. : 379-384

Springer Publishing Company

Access to resources Recommend Favorite