Sequential deposition of copper/alumina composites

Author: Wang X.   Ma J.   Maximenko A.   Olevsky E.   Stern M.   Guenin B.  

Publisher: Springer Publishing Company

ISSN: 0022-2461

Source: Journal of Materials Science, Vol.40, Iss.18, 2005-09, pp. : 4963-4965

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