Effect of the thickness of Bi–Te compound and Cu electrode on the resultant Seebeck coefficient in touching Cu/Bi–Te/Cu composites

By Yamashita Osamu   Odahara Hirotaka  

Journal of Materials Science, Vol. 42, Iss. 13, 2007-07 ,pp. : 5057-5067

Springer Publishing Company

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Temperature dependence of the local Seebeck coefficient near the boundary in touching Cu/Bi–Te/Cu composites

By Yamashita Osamu   Odahara Hirotaka  

Journal of Materials Science, Vol. 42, Iss. 16, 2007-08 ,pp. : 6828-6836

Springer Publishing Company

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Enhancement in thermoelectric power factor of M/T/N and M/Bi/M/Bi/M (M and N = Cu or Ni) composite devices welded with T = Bi or Bi_0.88Sb_0.12 alloy

By Yamashita Osamu   Odahara Hirotaka   Satou Kouji  

Journal of Materials Science, Vol. 40, Iss. 5, 2005-03 ,pp. : 1071-1077

Springer Publishing Company

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Power generation of the touching Cu/Bi-Te/Cu composites under the periodically alternating temperature gradients

By Yamashita Osamu   Odahara Hirotaka   Ochi Takahiro  

Journal of Materials Science, Vol. 42, Iss. 18, 2007-09 ,pp. : 7832-7842

Springer Publishing Company

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Enhancement of the thermoelectric figure of merit in p- and n-type Cu/Bi-Te/Cu composites

By Yamashita Osamu   Odahara Hirotaka  

Journal of Materials Science, Vol. 41, Iss. 10, 2006-05 ,pp. : 2795-2803

Springer Publishing Company

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