Vibration fracture behavior of Sn–9Zn–xCu lead-free solders

Author: Hung Fei-Yi   Lui Truan-Sheng   Chen Li-Hui   You Ji-Ge  

Publisher: Springer Publishing Company

ISSN: 0022-2461

Source: Journal of Materials Science, Vol.42, Iss.11, 2007-06, pp. : 3865-3873

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Abstract