Author: Hung Fei-Yi Lui Truan-Sheng Chen Li-Hui You Ji-Ge
Publisher: Springer Publishing Company
ISSN: 0022-2461
Source: Journal of Materials Science, Vol.42, Iss.11, 2007-06, pp. : 3865-3873
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Investigation of Ni-Microalloyed Sn-0.5Cu Lead-Free Solders
Advanced Materials Research, Vol. 2015, Iss. 1120, 2015-08 ,pp. :
Effect of Cu on the Electrochemical Corrosion Behavior of Sn-8Zn-3Bi Lead-Free Solder Alloy
Advanced Materials Research, Vol. 2015, Iss. 1095, 2015-04 ,pp. :