Effect of adding Ce on interfacial reactions between Sn–Ag solder and Cu

By Yoon Jeong-Won   Noh Bo-In   Choi Jung-Hyun   Jung Seung-Boo  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 7, 2011-07 ,pp. : 745-750

Springer Publishing Company

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Suppression of interfacial intermetallic compounds between Sn-9Zn solder and Cu-substrate by adding Cu-particles in the solder

By Wei G.  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 130-135

Springer Publishing Company

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Materials behaviour and intermetallics characteristics in the reaction between SnAgCu and Sn–Pb solder alloys

By Liu Changqing   Huang Zhiheng   Conway Paul   Thomson Rachel  

Journal of Materials Science, Vol. 42, Iss. 11, 2007-06 ,pp. : 4076-4086

Springer Publishing Company

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Influence of minor Ag nano-particles additions on the microstructure of Sn30Bi0.5Cu solder reacted with a Cu substrate

By Peng Changfei   Shen Jun   Xie Weidong   Chen Jie   Wu Cuiping   Wang Xiaochuan  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 7, 2011-07 ,pp. : 797-806

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Microstructure of interfacial reaction layer in Sn–Ag–Cu/electroless Ni (P) solder joint

By Kang Han-Byul   Bae Jee-Hwan   Yoon Jeong-Won   Jung Seung-Boo   Park Jongwoo   Yang Cheol-Woong  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 9, 2011-09 ,pp. : 1308-1312

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