Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications

By Anderson Iver  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 55-76

Springer Publishing Company

Access to resources Recommend Favorite

Effect of volume in interfacial reaction between eutectic Sn-Pb solder and Cu metallization in microelectronic packaging

By Sharif A.   Chan Y.C.   Islam R.A.  

Materials Science and Engineering: B, Vol. 106, Iss. 2, 2004-01 ,pp. : 120-125

Elsevier

Access to resources Recommend Favorite

The morphology and kinetic evolution of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu-0.5Al 2 O 3 composite solder/Cu interface during soldering reaction

By Chang S.  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 100-107

Springer Publishing Company

Access to resources Recommend Favorite

Correlation between interfacial microstructure and shear behavior of Sn–Ag–Cu solder ball joined with Sn–Zn–Bi paste

By Shih Po-Cheng   Lin Kwang-Lung  

Journal of Materials Science, Vol. 42, Iss. 8, 2007-04 ,pp. : 2574-2581

Springer Publishing Company

Access to resources Recommend Favorite

Relation between Kirkendall voids and intermetallic compound layers in the SnAg/Cu solder joints

By Yu Chun  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 124-129

Springer Publishing Company

Access to resources Recommend Favorite