Effects of rare earth additions on the microstructural evolution and microhardness of Sn30Bi0.5Cu and Sn35Bi1Ag solder alloys

By Shen Jun  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 156-163

Springer Publishing Company

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Wetting of Al pads by Sn–8.8Zn and Sn–8.7Zn–1.5(Ag, In) alloys

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Journal of Materials Science, Vol. 47, Iss. 24, 2012-12 ,pp. : 8472-8476

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Influence of minor Ag nano-particles additions on the microstructure of Sn30Bi0.5Cu solder reacted with a Cu substrate

By Peng Changfei   Shen Jun   Xie Weidong   Chen Jie   Wu Cuiping   Wang Xiaochuan  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 7, 2011-07 ,pp. : 797-806

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Correlation between interfacial microstructure and shear behavior of Sn–Ag–Cu solder ball joined with Sn–Zn–Bi paste

By Shih Po-Cheng   Lin Kwang-Lung  

Journal of Materials Science, Vol. 42, Iss. 8, 2007-04 ,pp. : 2574-2581

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Effect of Bi content on spalling behavior of Sn–Bi–Zn–Ag/Cu interface

By Wang X.   Liu Y.   Gao Z.  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 1, 2011-01 ,pp. : 14-19

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