Effects of trace amounts of rare earth additions on the microstructures and interfacial reactions of Sn57Bi1Ag/Cu solder joints

By Wu Cuiping  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 14-21

Springer Publishing Company

Access to resources Recommend Favorite

Influence of minor Ag nano-particles additions on the microstructure of Sn30Bi0.5Cu solder reacted with a Cu substrate

By Peng Changfei   Shen Jun   Xie Weidong   Chen Jie   Wu Cuiping   Wang Xiaochuan  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 7, 2011-07 ,pp. : 797-806

Springer Publishing Company

Access to resources Recommend Favorite

Effects of Co additions on electromigration behaviors in Sn–3.0 Ag–0.5 Cu-based solder joint

By Ma Limin   Xu Guangchen   Sun Jia   Guo Fu   Wang Xitao  

Journal of Materials Science, Vol. 46, Iss. 14, 2011-07 ,pp. : 4896-4905

Springer Publishing Company

Access to resources Recommend Favorite

Wetting of Cu by Bi–Ag based alloys with Sn and Zn additions

By Fima Przemysław   Gąsior Władysław   Sypień Anna   Moser Zbigniew  

Journal of Materials Science, Vol. 45, Iss. 16, 2010-08 ,pp. : 4339-4344

Springer Publishing Company

Access to resources Recommend Favorite

Effects of microstructure and temperature on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder

By Wang Mingna  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 148-155

Springer Publishing Company

Access to resources Recommend Favorite