Determination of thermal stress intensity factors for an interface crack in a graded orthotropic coating-substrate structure

By Chen Jian  

International Journal of Fracture, Vol. 133, Iss. 4, 2005-06 ,pp. : 303-328

Springer Publishing Company

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Stress intensity factors for an interface crack between a functionally graded coating and a homogeneous substrate

By El-Borgi S.   Erdogan F.   Hatira F. Ben  

International Journal of Fracture, Vol. 123, Iss. 3-4, 2003-10 ,pp. : 139-162

Springer Publishing Company

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A theoretical and numerical study of thin film delamination using the pull-off test

By Sun Z.   Wan K.-T.   Dillard D.A.  

International Journal of Solids and Structures, Vol. 41, Iss. 3, 2004-02 ,pp. : 717-730

Elsevier

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On the effective constitutive properties of a thin adhesive layer loaded in peel

By Andersson Tobias   Biel Anders  

International Journal of Fracture, Vol. 141, Iss. 1-2, 2006-09 ,pp. : 227-246

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High-cycle fatigue of micron-scale polycrystalline silicon films: fracture mechanics analyses of the role of the silica/silicon interface

By Muhlstein C.L.   Ritchie R.O.  

International Journal of Fracture, Vol. 119, Iss. 4, 2003-01 ,pp. : 449-474

Springer Publishing Company

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