Enhanced reliability of high-density wiring (HDW) substrates through new base substrate and dielectric materials

Author: Hegde Shashikant   Pucha Raghuram V.   Sitaraman Suresh K.  

Publisher: Springer Publishing Company

ISSN: 0957-4522

Source: Journal of Materials Science: Materials in Electronics, Vol.15, Iss.5, 2004-05, pp. : 287-296

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Abstract