Author: Lee Joo-Won Paek Kyeong-Kap Jang Jin Ju Byeong-Kwon
Publisher: Springer Publishing Company
ISSN: 0957-4522
Source: Journal of Materials Science: Materials in Electronics, Vol.16, Iss.3, 2005-03, pp. : 125-130
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Effect of milling on the damping behavior of nano-structured copper
By Srikanth N. Thein M.A. Gupta M.
Materials Science and Engineering: A, Vol. 366, Iss. 1, 2004-02 ,pp. :