Journal of Materials Science: Materials in Electronics,volume 16,issue 3  (03-2014)

Period of time： 2014年3期

Publisher： Springer Publishing Company

Founded in： 1990

Total resources： 58

ISSN： 0957-4522

Subject： TB General Industrial Technology

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Journal of Materials Science: Materials in Electronics,volume 16,issue 3

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Improvement of porous polysilicon nano-structured emitter for vacuum packaged devices

By Lee Joo-Won,Paek Kyeong-Kap,Jang Jin,Ju Byeong-Kwon in (2005)

Journal of Materials Science: Materials in Electronics,volume 16,issue 3 , Vol. 16, Iss. 3, 2005-03 , pp. 125-130

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Spin-valve effect in an FM/Si/FM junction

By Lee K.,Lee H.,Chang J.,Han S.,Kim Y.,Lee W. in (2005)

Journal of Materials Science: Materials in Electronics,volume 16,issue 3 , Vol. 16, Iss. 3, 2005-03 , pp. 131-133

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Superconductors of the BPSCCO system obtained from rapid cooling process

By Carvalho C.,Yukimitu K.,Reynoso V.,Moraes J.,Araüjo E.,Alves N.,Rainho S. in (2005)

Journal of Materials Science: Materials in Electronics,volume 16,issue 3 , Vol. 16, Iss. 3, 2005-03 , pp. 135-138

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The use of yttrium (III) isopropoxide to improve thermal conductivity of polycrystalline aluminum nitride (AlN) ceramics

By Jünior Adolfo,Shanafield Daniel in (2005)

Journal of Materials Science: Materials in Electronics,volume 16,issue 3 , Vol. 16, Iss. 3, 2005-03 , pp. 139-144

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DC conduction behaviour of niobium doped barium stannate

By Singh Prabhakar,Parkash Om,Kumar Devendra in (2005)

Journal of Materials Science: Materials in Electronics,volume 16,issue 3 , Vol. 16, Iss. 3, 2005-03 , pp. 145-148

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Microwave dielectric properties of Ba5+nTinNb4O15+3n ceramics

By Fang Liang,Chen L.,Zhang Hui,Hong X.,Diao C.,Liu H. in (2005)

Journal of Materials Science: Materials in Electronics,volume 16,issue 3 , Vol. 16, Iss. 3, 2005-03 , pp. 149-151

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Interfacial reactions of Sn-3.5% Ag and Sn-3.5% Ag-0.5% Cu solder with electroless Ni/Au metallization during multiple reflow cycles

By Sharif Ahmed,Chan Y. in (2005)

Journal of Materials Science: Materials in Electronics,volume 16,issue 3 , Vol. 16, Iss. 3, 2005-03 , pp. 153-158

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Solution route synthesis and characterization of nanocrystalline Bi2Ru2O7 for usage in resistor paste application

By Gurunathan K.,Vyawahare N.,Phatak G.,Amalnerkar D. in (2005)

Journal of Materials Science: Materials in Electronics,volume 16,issue 3 , Vol. 16, Iss. 3, 2005-03 , pp. 159-168

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Role of imposed cyclic straining on the stress relaxation behavior of eutectic Sn-3.5Ag solder joints

By Rhee H.,Subramanian K.,Lee A. in (2005)

Journal of Materials Science: Materials in Electronics,volume 16,issue 3 , Vol. 16, Iss. 3, 2005-03 , pp. 169-176

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An analysis of the distributions of electronic states associated with hydrogenated amorphous silicon

By Malik Saad,O’Leary Stephen in (2005)

Journal of Materials Science: Materials in Electronics,volume 16,issue 3 , Vol. 16, Iss. 3, 2005-03 , pp. 177-181

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Total 10 item(s)