Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys

By Chawla N.   Sidhu R.  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 175-189

Springer Publishing Company

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Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications

By Anderson Iver  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 55-76

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Electrochemical migration of Sn-Pb and lead free solder alloys under distilled water

By Yu D.   Jillek W.   Schmitt E.  

Journal of Materials Science: Materials in Electronics, Vol. 17, Iss. 3, 2006-03 ,pp. : 219-227

Springer Publishing Company

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Creep and fatigue behaviors of the lead-free Sn–Ag–Cu–Bi and Sn60Pb40 solder interconnections at elevated temperatures

By Zhang X.   Yu C.   Shrestha S.   Dorn L.  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 6, 2007-06 ,pp. : 665-670

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Measurement and prediction of Young’s modulus of a Pb-free solder

By Chawla N.   Ochoa F.   Ganesh V. V.   Deng X.   Koopman M.   Chawla K. K.   Scarritt S.  

Journal of Materials Science: Materials in Electronics, Vol. 15, Iss. 6, 2004-06 ,pp. : 385-388

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