Author: Mahmudi R. Geranmayeh A. Mahmoodi S. Khalatbari A.
Publisher: Springer Publishing Company
ISSN: 0957-4522
Source: Journal of Materials Science: Materials in Electronics, Vol.18, Iss.10, 2007-10, pp. : 1071-1078
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
By Zhang X. Yu C. Shrestha S. Dorn L.
Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 6, 2007-06 ,pp. :
Effect of Cu on the Electrochemical Corrosion Behavior of Sn-8Zn-3Bi Lead-Free Solder Alloy
Advanced Materials Research, Vol. 2015, Iss. 1095, 2015-04 ,pp. :
Liquidus and Wettablity of Lead-Free Solder Alloys
Advanced Materials Research, Vol. 2015, Iss. 1120, 2015-08 ,pp. :