Room-temperature indentation creep of lead-free Sn–Bi solder alloys

Author: Mahmudi R.   Geranmayeh A.   Mahmoodi S.   Khalatbari A.  

Publisher: Springer Publishing Company

ISSN: 0957-4522

Source: Journal of Materials Science: Materials in Electronics, Vol.18, Iss.10, 2007-10, pp. : 1071-1078

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Abstract