Author: Shi J. Huang S. Chu J. Zhu H. Wang Z. Li X. Zhang D. Sun Z. Cheng W. Huang F. Yin X.
Publisher: Springer Publishing Company
ISSN: 0957-4522
Source: Journal of Materials Science: Materials in Electronics, Vol.21, Iss.10, 2010-10, pp. : 1005-1013
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Abstract
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