The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)₆Sn₅ compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction

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Journal of Materials Science, Vol. 48, Iss. 2, 2013-01 ,pp. : 857-865

Springer Publishing Company

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Interfacial reactions of Sn-3.5% Ag and Sn-3.5% Ag-0.5% Cu solder with electroless Ni/Au metallization during multiple reflow cycles

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Journal of Materials Science: Materials in Electronics, Vol. 16, Iss. 3, 2005-03 ,pp. : 153-158

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Microstructure of interfacial reaction layer in Sn–Ag–Cu/electroless Ni (P) solder joint

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Solid state intermetallic compound layer growth between Sn-8Zn-3Bi solder and bare copper substrate

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Journal of Materials Science: Materials in Electronics, Vol. 16, Iss. 8, 2005-08 ,pp. : 523-528

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Degradation of Sn37Pb and Sn3.5Ag0.5Cu solder joints between Au/Ni (P)/Cu pads stressed with moderate current density

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