Effect of ultrasonication medium on the properties of copper nanoparticle-filled epoxy composite for electrical conductive adhesive (ECA) application

Author: Chan K.   Mariatti M.   Lockman Z.   Sim L.  

Publisher: Springer Publishing Company

ISSN: 0957-4522

Source: Journal of Materials Science: Materials in Electronics, Vol.21, Iss.8, 2010-08, pp. : 772-778

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Abstract