Effects of different kinds of seed layers and heat treatment on adhesion characteristics of Cu/(Cr or Ni–Cr)/PI interfaces in flexible printed circuits

Author： Noh Bo-In   Yoon Jeong-Won   Lee Bo-Young   Jung Seung-Boo  

Publisher： Springer Publishing Company

ISSN： 0957-4522

Source： Journal of Materials Science: Materials in Electronics, Vol.22, Iss.7, 2011-07, pp. : 790-796

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