Influence of POSS nano-particles on Sn–3.0Ag–0.5Cu–xPOSS/Cu composite solder joints during isothermal aging

By Shen Jun   Tang Qin   Pu Yayun   Zhai Dajun   Cao Zhongming   Chen Jie  

Journal of Materials Science: Materials in Electronics, Vol. 24, Iss. 12, 2013-12 ,pp. : 4881-4887

Springer Publishing Company

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Effects of rare earth additions on the microstructural evolution and microhardness of Sn30Bi0.5Cu and Sn35Bi1Ag solder alloys

By Shen Jun  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 156-163

Springer Publishing Company

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Effects of Co additions on electromigration behaviors in Sn–3.0 Ag–0.5 Cu-based solder joint

By Ma Limin   Xu Guangchen   Sun Jia   Guo Fu   Wang Xitao  

Journal of Materials Science, Vol. 46, Iss. 14, 2011-07 ,pp. : 4896-4905

Springer Publishing Company

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Effects of microstructure and temperature on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder

By Wang Mingna  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 148-155

Springer Publishing Company

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The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)₆Sn₅ compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction

By Tseng Chien-Fu   Duh Jenq-Gong  

Journal of Materials Science, Vol. 48, Iss. 2, 2013-01 ,pp. : 857-865

Springer Publishing Company

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