Active Soldering of Indium Tin Oxide (ITO) With Cu in Air Using an Sn3.5Ag4Ti(Ce, Ga) Filler

Author： Chang S. Y.   Tsao L. C.   Chiang M. J.   Tung C. N.   Pan G. H.   Chuang T. H.  

Publisher： Springer Publishing Company

ISSN： 1059-9495

Source： Journal of Materials Engineering and Performance, Vol.12, Iss.4, 2003-08, pp. : 383-389

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