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Emerald Group Publishing Ltd

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Solid-liquid reactions: The effect of Cu content on Sn-Ag-Cu interconnects

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JOM, Vol. 57, Iss. 6, 2005-06 ,pp. : 30-35

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Investigation of the effect of indium addition on wettability of Sn-Ag-Cu solders

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The effect of Pb contamination on the microstructure and mechanical properties of SnAg/Cu and SnSb/Cu solder joints in SMT

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