Clad metals by roll bonding for SOFC interconnects

Author: Chen L.   Jha B.   Yang Zhenguo   Xia Guang-Guang   Stevenson Jeffry   Singh Prabhakar  

Publisher: Springer Publishing Company

ISSN: 1059-9495

Source: Journal of Materials Engineering and Performance, Vol.15, Iss.4, 2006-08, pp. : 399-403

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Abstract