Wetting of Al pads by Sn–8.8Zn and Sn–8.7Zn–1.5(Ag, In) alloys

By Fima Przemysław   Berent Katarzyna   Pstruś Janusz   Gancarz Tomasz  

Journal of Materials Science, Vol. 47, Iss. 24, 2012-12 ,pp. : 8472-8476

Springer Publishing Company

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Sn–Zn low temperature solder

By Suganuma Katsuaki   Kim Kuen-Soo  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 121-127

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Effect of composition and thermal cycling on the adhesion strength of Sn-Zn-Al solder hot-dipped on Cu substrate

By Yu S-P.   Wang H-C.   Wang M-C.   Hon M-H.  

Journal of Materials Science, Vol. 37, Iss. 1, 2002-01 ,pp. : 185-190

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Reliability studies of Sn–9Zn/Cu and Sn–9Zn–0.3Ag/Cu soldered joints with aging treatment

By Chen Wen-Xue   Xue Song-Bai   Wang Hui   Hu Yu-Hua  

Journal of Materials Science: Materials in Electronics, Vol. 21, Iss. 8, 2010-08 ,pp. : 779-786

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Concentration fluctuations and surface tension in liquid Au-Sn-Zn

By Terzieff P.  

Journal of Materials Science, Vol. 40, Iss. 14, 2005-07 ,pp. : 3759-3763

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