Thermal Behaviour of Silver-Filled Epoxy Adhesives: Technological implications in microelectronics

Author: Damasceni A.   Dei L.   Guasti F.  

Publisher: Springer Publishing Company

ISSN: 1388-6150

Source: Journal of Thermal Analysis and Calorimetry, Vol.66, Iss.1, 2001-10, pp. : 223-232

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Abstract