Advances in thermal management materials for electronic applications

By Jin Sungho  

JOM, Vol. 50, Iss. 6, 1998-06 ,pp. : 46-46

Springer Publishing Company

Access to resources Recommend Favorite

Microstructure and Thermal Physical Properties of a β­SiCp/Al Composite for Electronic Packaging Produced by Powder Metallurgy

By  

Key Engineering Materials, Vol. 2017, Iss. 727, 2017-03 ,pp. : 565-570

Trans Tech Publications

Access to resources Recommend Favorite

Effect of thermal aging and fatigue on failure resistance of aerospace composite materials

By  

IOP Conference Series: Materials Science and Engineering, Vol. 5, Iss. 1, 2009-09 ,pp. : 141-149

IOP Publishing

Access to resources Recommend Favorite

Numerical investigation of the thermal behavior of heated natural composite materials

By  

IOP Conference Series: Materials Science and Engineering, Vol. 95, Iss. 1, 2015-11 ,pp. : 6-12

IOP Publishing

Access to resources Recommend Favorite

Automatized Estimation of the Effective Thermal Conductivity of Carbon Fiber Reinforced Composite Materials

By  

Defect and Diffusion Forum, Vol. 2017, Iss. 370, 2017-01 ,pp. : 177-183

Trans Tech Publications

Access to resources Recommend Favorite