Communication: Formation of Intermetallic Compounds in SnPbAg, SnAg, and SnAgCu Solders on Ni/Au Metallization

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Metallurgical and Materials Transactions A, Vol. 32, Iss. 10, 2001-10 ,pp. : 2666-2668

Springer Publishing Company

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Effects of Pb contamination on the eutectic Sn-Ag solder joint

By Choi S   Bieler T.R.   Subramanian K.N.   Lucas J.P.  

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The effect of Pb contamination on the microstructure and mechanical properties of SnAg/Cu and SnSb/Cu solder joints in SMT

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Investigation on fatigue behavior of single SnAgCu/SnPb solder joint by rapid thermal cycling

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Soldering & Surface Mount Technology, Vol. 27, Iss. 2, 2015-04 ,pp. : 76-83

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Microstructural Investigation of Sn-Ag and Sn-Ag Solder Joints*

By Chada S   Herrmann A   Laub W   Fournelle R   Shangguan** D   Achari** A  

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