Silver nanoparticles effect on the wettability of Sn-Ag-Cu solder pastes and solder joints microstructure on copper

By Bukat K.   Koscielski M.   Sitek J.   Jakubowska M.   Mlozniak A.  

Soldering & Surface Mount Technology, Vol. 23, Iss. 3, 2011-06 ,pp. : 150-160

Emerald Group Publishing Ltd

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Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloys

By Reid M.   Punch J.   Collins M.   Ryan C.  

Soldering & Surface Mount Technology, Vol. 20, Iss. 4, 2008-09 ,pp. : 3-8

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Research Summary: Sn-Ag-Cu Solders and Solder Joints: Alloy Development, Microstructure, and Properties

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JOM, Vol. 54, Iss. 6, 2002-06 ,pp. : 26-29

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A comparative study of microstructure and mechanical properties among Cu/Sn/Cu, Ni/Sn/Ni and Cu/Sn/Ni solder joints

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The effects of additives to SnAgCu alloys on microstructure and drop impact reliability of solder joints

By Liu Weiping   Lee Ning-Cheng  

JOM, Vol. 59, Iss. 7, 2007-07 ,pp. : 26-31

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