Composition and heat-treatment effects on the adhesion strength of Sn-Zn-Al solders on Cu substrate

Author： Yu Shan-Pu   Hon Min-Hsiung   Wang Hsin-Chien   Wang Moo-Chin  

Publisher： Springer Publishing Company

ISSN： 1543-1851

Source： JOM, Vol.52, Iss.6, 2000-06, pp. : 36-39

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