The magnetic field-assisted assembly of nanoscale semiconductor devices: A new technique

Author： Shet Sudhakar   Mehta Vishal   Fiory Anthony   Ravindra N.   Lepselter Martin  

Publisher： Springer Publishing Company

ISSN： 1543-1851

Source： JOM, Vol.56, Iss.10, 2004-10, pp. : 32-34

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Effect of Micrononuniform Heating of Powder in Field-Assisted Sintering on Shrinkage Kinetics

By Kuz'mov A.  

Powder Metallurgy and Metal Ceramics, Vol. 51, Iss. 11-12, 2013-03 ,pp. : 657-665

Springer Publishing Company

Access to resources Recommend Favorite

Ultrafast electric field-assisted pump-probe spectroscopy in poly(9,9-dioctylfluorene) light-emitting diodes

By Virgili T.   Cerullo G.   Gadermaier C.   Luer L.   Lanzani G.   Bradley D.D.C.  

Synthetic Metals, Vol. 139, Iss. 3, 2003-10 ,pp. : 663-666

Elsevier

Access to resources Recommend Favorite

Transmittance properties and TEM observation of metal doped glass by field-assisted ion exchange

By  

IOP Conference Series: Materials Science and Engineering, Vol. 61, Iss. 1, 2014-08 ,pp. : 82-86

IOP Publishing

Access to resources Recommend Favorite

Exploitation of Field-Assisted Sintering Technology (FAST) to Produce Pre-Forged Billets from Metastable Beta Titanium Alloy Powder

By  

Key Engineering Materials, Vol. 2016, Iss. 716, 2016-11 ,pp. : 800-816

Trans Tech Publications

Access to resources Recommend Favorite

Copper interconnects for semiconductor devices

By Merchant Sailesh   Kang Seung   Sanganeria Mahesh   Schravendijk Bart   Mountsier Tom  

JOM, Vol. 53, Iss. 6, 2001-06 ,pp. : 43-48

Springer Publishing Company

Access to resources Recommend Favorite