The observation and simulation of Sn-Ag-Cu solder solidification in chip-scale packaging

Author： Kim Keun-Soo   Suganuma Katsuaki   Hwang Chi-Won   Kim Jong-Min  

Publisher： Springer Publishing Company

ISSN： 1543-1851

Source： JOM, Vol.56, Iss.6, 2004-06, pp. : 39-43

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