Electrochemical interfacial phenomena under microgravity: Part 2. Numerical analysis of the rate of ionic mass transfer accompanying anodic copper dissolution

Author： Konishi Y.   Fukunaka Y.   Kuribayashi K.  

Publisher： Springer Publishing Company

ISSN： 1543-1916

Source： Metallurgical and Materials Transactions B, Vol.30, Iss.4, 1999-08, pp. : 779-790

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