A microstructural study of dislocation substructures formed in metal foil substrates during ultrasonic wire bonding

Author： Murdeshwar Nikhil   Krzanowski James  

Publisher： Springer Publishing Company

ISSN： 1543-1940

Source： Metallurgical and Materials Transactions A, Vol.28, Iss.12, 1997-12, pp. : 2663-2671

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