Room-temperature diffusion in Cu/Ag thin-film couples caused by anodic dissolution

By Jones Denny   Jankowski Alan   Davidson Gail  

Metallurgical and Materials Transactions A, Vol. 28, Iss. 3, 1997-03 ,pp. : 843-850

Springer Publishing Company

Access to resources Recommend Favorite

Solid-Phase Diffusion at a Galvanostatic Anodic Dissolution of Zn-Ag and Cu-Au Alloy

By Kozaderov O.   Bobrinskaya E.   Kartashova T.   Vvedenskii A.  

Protection of Metals, Vol. 41, Iss. 5, 2005-09 ,pp. : 449-459

MAIK Nauka/Interperiodica

Access to resources Recommend Favorite

Kinetics of Discontinuous Precipitation and Dissolution in Cu–Ag Alloys

By Gupta Shant P.  

Canadian Metallurgical Quarterly, Vol. 37, Iss. 2, 1998-04 ,pp. : 141-159

Maney Publishing

Access to resources Recommend Favorite

Overview: Diffusion Soldering for Stable High-Temperature Thin-Film Bonds

By Studnitzky Thomas   Schmid-Fetzer Rainer  

JOM, Vol. 54, Iss. 12, 2002-12 ,pp. : 58-63

Springer Publishing Company

Access to resources Recommend Favorite

Room-temperature ductile carbides

By Barsoum M.   El-Raghy T.  

Metallurgical and Materials Transactions A, Vol. 30, Iss. 2, 1999-02 ,pp. : 363-369

Springer Publishing Company

Access to resources Recommend Favorite