Author: Govindarajan S. Moore J. Disam J. Suryanarayana C.
Publisher: Springer Publishing Company
ISSN: 1543-1940
Source: Metallurgical and Materials Transactions A, Vol.30, Iss.13, 1999-03, pp. : 799-806
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
By Govindarajan S. Moore J.J. Disam J. Suryanarayana C.
Metallurgical and Materials Transactions A, Vol. 30, Iss. 3, 1999-03 ,pp. :
By Kulkarni Anand Herman Herbert DeCarlo Francesco Subramanian Ramesh
Metallurgical and Materials Transactions A, Vol. 35, Iss. 7, 2004-07 ,pp. :
Electroless Deposition of NiMoB Diffusion Barrier Layer Film for ULSI-Cu Metallization
Key Engineering Materials, Vol. 2017, Iss. 727, 2017-03 ,pp. :
Metallurgical and Materials Transactions A, Vol. 36, Iss. 1, 2005-01 ,pp. :