Growth of a Au-Ni-Sn Intermetallic Compound on the Solder-Substrate Interface after Aging

Author: Minor A. M.   Morris J. W.  

Publisher: Springer Publishing Company

ISSN: 1543-1940

Source: Metallurgical and Materials Transactions A, Vol.31, Iss.3, 2000-03, pp. : 798-800

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Abstract