Effects of thermal history on the intermetallic growth and mechanical strength of Pb-free and Sn-Pb BGA solder balls

Author： Liang J.   Dariavach N.   Callahan P.   Shangguan D.  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.19, Iss.1, 2007-02, pp. : 4-14

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