Mechanical characterization of Sn-3.5Ag solder joints at various temperatures

By Rhee H.   Subramanian K.N.   Lee A.   Lee J.G.  

Soldering & Surface Mount Technology, Vol. 15, Iss. 3, 2003-12 ,pp. : 21-26

Emerald Group Publishing Ltd

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Influence of Reflow and Thermal Aging on the Shear Strength and Fracture Behavior of Sn-3.5Ag Solder/Cu Joints

By Deng X.   Sidhu R.S.   Johnson P.   Chawla N.  

Metallurgical and Materials Transactions A, Vol. 36, Iss. 1, 2005-01 ,pp. : 55-64

Springer Publishing Company

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Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. % W barrier film by nanoindentation

By Haseeb A. S. M. A.   Beake B.   Haseeb A. S. M. A.  

Soldering & Surface Mount Technology, Vol. 27, Iss. 2, 2015-04 ,pp. : 90-94

Emerald Group Publishing Ltd

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Intermetallic morphology around Ni particles in Sn-3.5Ag solder

By Lee J.G.   Guo F.   Subramanian K.N.   Lucas J.P.  

Soldering & Surface Mount Technology, Vol. 14, Iss. 2, 2002-07 ,pp. : 11-17

Emerald Group Publishing Ltd

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The effects of cooling rate on microstructure and mechanical behavior of Sn-3.5Ag solder

By Ochoa F.   Williams J.   Chawla N.  

JOM, Vol. 55, Iss. 6, 2003-06 ,pp. : 56-60

Springer Publishing Company

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