Influence of Reflow and Thermal Aging on the Shear Strength and Fracture Behavior of Sn-3.5Ag Solder/Cu Joints

Author: Deng X.   Sidhu R.S.   Johnson P.   Chawla N.  

Publisher: Springer Publishing Company

ISSN: 1543-1940

Source: Metallurgical and Materials Transactions A, Vol.36, Iss.1, 2005-01, pp. : 55-64

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Abstract