Copper Diffusion Into Silicon Substrates Through TaN and Ta/TaN Multilayer Barriers

Author： Fréty N.   Bernard F.   Nazon J.   Sarradin J.   Tedenac J.C.  

Publisher： Springer Publishing Company

ISSN： 1547-7037

Source： Journal of Phase Equilibria & Diffusion, Vol.27, Iss.6, 2006-12, pp. : 590-597

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