An Overview of the Use of Electrically Conductive Adhesives (ECAs) as a Solder Replacement

Author: Lewis H. J.   Coughlan F. M.  

Publisher: Taylor & Francis Ltd

ISSN: 1568-5616

Source: Journal of Adhesion Science and Technology, Vol.22, Iss.8-9, 2008-06, pp. : 801-813

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract