Related content

Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloys

By Reid M.   Punch J.   Collins M.   Ryan C.  

Soldering & Surface Mount Technology, Vol. 20, Iss. 4, 2008-09 ,pp. : 3-8

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Experiments on the aging of Sn–Ag–Cu solder alloys

By Snugovsky L.   Perovic D. D.   Rutter J. W.  

Powder Metallurgy, Vol. 48, Iss. 2, 2005-06 ,pp. : 193-198

Maney Publishing

Access to resources Recommend Favorite

The effect of Pb contamination on the microstructure and mechanical properties of SnAg/Cu and SnSb/Cu solder joints in SMT

By Zhu Qinong   Sheng Mei   Luo Le  

Soldering & Surface Mount Technology, Vol. 12, Iss. 3, 2000-12 ,pp. : 19-24

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Influence of Indium and Antimony Additions on Mechanical Properties and Microstructure of Sn-3.0Ag-0.5Cu Lead Free Solder Alloys

By  

Solid State Phenomena, Vol. 2017, Iss. 266, 2017-11 ,pp. : 196-200

Trans Tech Publications

Access to resources Recommend Favorite

Controlling Ag₃Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying

By Kang Sung   Shih Da-Yuan   Leonard Donovan   Henderson Donald   Gosselin Timothy   Cho Sung-il   Yu Jin   Choi Won  

JOM, Vol. 56, Iss. 6, 2004-06 ,pp. : 34-38

Springer Publishing Company

Access to resources Recommend Favorite