TEM observation of interfaces in a solder joint in a semiconductor device

Publisher： IOP Publishing

ISSN： 1468-6996

Source： Science and Technology of Advanced Materials, Vol.3, Iss.3, 2002-06, pp. : 22-31

Access to resources Favorite

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

TEM analysis of epitaxial semiconductor layers with high stacking fault densities considering artifacts induced by the cross-section geometry

By Walter T.   Gerthsen D.  

Ultramicroscopy, Vol. 81, Iss. 3, 2000-04 ,pp. : 279-288

Elsevier

Access to resources Recommend Favorite

REM in a UHV TEM for the observation of dynamic phase transformation processes on the Cu 3 Au(111) surface

By Huang Y.   Gajdardziska-Josifovska M.   Cowley J.M.  

Ultramicroscopy, Vol. 57, Iss. 4, 1995-03 ,pp. : 391-408

Elsevier

Access to resources Recommend Favorite

Selective specimen preparation for TEM observation of the cross-section of individual carbon nanotube/metal junctions

By Wei B.   Kohler-Redlich P.   Bader U.   Heiland B.   Spolenak R.   Arzt E.   Ruhle M.  

Ultramicroscopy, Vol. 85, Iss. 2, 2000-10 ,pp. : 93-98

Elsevier

Access to resources Recommend Favorite

Decomposition of Fe5C2 catalyst particles in carbon nanofibers during TEM observation

By  

Science and Technology of Advanced Materials, Vol. 10, Iss. 1, 2009-01 ,pp. : 131-135

IOP Publishing

Access to resources Recommend Favorite

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

By  

Science and Technology of Advanced Materials, Vol. 16, Iss. 3, 2015-06 ,pp. : 149-166

IOP Publishing

Access to resources Recommend Favorite