Identification of the lamination stack's behavior simulated with a multi‐scale homogenization using a progressive contact formulation

Publisher： John Wiley & Sons Inc

E-ISSN： 1617-7061|14|1|253-254

ISSN： 1617-7061

Source： PROCEEDINGS IN APPLIED MATHEMATICS & MECHANICS (ELECTRONIC), Vol.14, Iss.1, 2014-12, pp. : 253-254

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