Pattern Roughness Mitigation of 22 nm Lines and Spaces: The Impact of a H2 Plasma Treatment

Publisher: John Wiley & Sons Inc

E-ISSN: 1612-8869|12|2|153-161

ISSN: 1612-8850

Source: PLASMA PROCESSES AND POLYMERS (ELECTRONIC), Vol.12, Iss.2, 2015-02, pp. : 153-161

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Abstract