Microstructure, Thermal Conductivity, and Electrical Properties of In Situ Pressureless Densified SiC–BN Composites

E-ISSN： 1551-2916|98|3|879-887

ISSN： 0002-7820

Source： JOURNAL OF THE AMERICAN CERAMIC SOCIETY, Vol.98, Iss.3, 2015-03, pp. : 879-887

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